AMD Announces New AM1 Platform

AMD Announces New AM1 Platform

 AMD today announced the introduction of its AM1 platform featuring the AMD quad-core and dual-core "Kabini" APU into the component channel for system builders. Combined with motherboards from leading manufacturers, the new AM1 platform will deliver award-winning Graphics Core Next (GCN) architecture and AMD "Jaguar" CPU cores, and bear the AMD Athlon and AMD Sempron APU brands. This will create an ecosystem of flexible and upgradable platforms at compelling price points that also feature USB 3.0 and SATA 6 Gb/s support, and microATX and miniITX motherboards for sleek and power-efficient small form factor PCs.

 Availability of "Kabini" desktops and components are slated to be on-shelf in select regions beginning early April, with global availability expected on April 9.

 "AMD continues our APU technology leadership by introducing the AM1 platform with 'Socketed Kabini', an APU designed for the mainstream market," said Bernd Lienhard, corporate vice president and general manager, Client Business Unit, AMD. "The AM1 platform gives us a great opportunity to deliver a flexible infrastructure environment, and provides a multitude of options for consumers and system builders looking for upgradeability packed into an extremely affordable solution."

 "Socketed Kabini" allows for exceptional productivity, web browsing, and compute acceleration for the larger mainstream, emerging markets looking for outstanding value and performance at low power.

 The AMD AM1 platform delivers balanced computing with DirectX 11.2 and Windows 8.1 support to mainstream markets. In addition, motherboard manufacturers including, ASRock, ASUS, BIOSTAR, ECS, Gigabyte and MSI are poised to deliver a range of next- generation desktop motherboards based on socket FS1b. These motherboards will support the latest specifications of native USB 3.0 and SATA 6 Gb/s for AMD Athlon and Sempron-series APUs for the AM1 platform.

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 source: techpowerup.com

3D-printed food technology

Hershey and 3D Systems join forces to develop 3D-printed food technology

Hershey and 3D Systems are partnering together to develop new products (Photo: Shutterstock)

 We've seen a cornucopia of 3D food printers specialized for consumer and prosumer chefs, from the multipurpose Foodini to 3D Systems' ChefBot. Now a major corporation has expressed interest in the sprouting 3D-printed food industry – chocolate-maker Hershey has announced a development partnership with 3D Systems.

 The announcement mentioned plans to develop not only new candy confections with the technology, but also a new class of printers. The press release described Hershey as embracing new technologies to move its candies into the future, though also left the language vague enough to include foods that weren't candies.

 3D Systems made headlines earlier this month when it announced a sugar printer which doesn't print in chocolate, though a representative of the company describes some of their recipes as tasting like a chocolate cookie and others as having more of a candy consistency.

 Chocolate printing systems have unique complexities inherent with chocolate, such as keeping the chocolate flowing and tempering it properly for a nice finish and snap.

 The partnership is part of 3D's described goal of mainstreaming 3D printing and expanding into edibles.

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 source: gizmag.com